HB Blue LED Chip Thermal Electric Cooler-CuW, CuMo, CuMoCu Substrate
Material: Tungsten Copper (CuW), Molybdenum Copper (CuMo), Copper Molybdenum Copper (CuMoCu) Tickness:0.001"~0.008"
Size: 2",3",4",6",8"
Surface: Mirror
Method: Powder Metallurgy.
SH-RareMetal capability on pure Mo. Foil: Min. 0.01mm
SH-RareMetal capability on pure W. Foil: Min. 0.02mm
SH-RareMetal capability on W alloy. Foil: Min. 0.02mm
SH-RareMetal capability on WCu Foil: Min. 0.04mm
SH-RareMetal capability on MoCu Foil: Min. 0.025mm
SH-RareMetal capability on Ti. Foil: Min. 0.01mm
SH-RareMetal capability on Ta. Foil: Min. 0.01mm
SH-RareMetal capability on Nb. Foil: Min. 0.01mm
SH-RareMetal capability on Zr. Foil: Min. 0.01mm
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